Solder for aluminum.



LOUIS GOPPMAN, OF PITTSBUBG, PENNSYLVANIA.

SOLDER FOB ALUMINUM.

No Drawing.

Specification of Letters Patent. Application filed July 26, 1909. Serial No. 509,548.

Patented Nov. 9, 1909.

To all whom it may concern:

Be it known that I, LOUIS GOPPMAN, a subject of the Czar. of Russia, and residing in the city of Pittsburg, in the county of Allegheny and State of Pennsylvania, have invented or discovered new and useful Improvements in Solder for Aluminum, of which the following is a specification.

My invention consists in a new and im" proved soldering compound for useiu sol dering aluminum and for similar purposes.

Hitherto the art of working aluminum has been greatly retarded in its development by the lack of an eflicient solder and the use of the metal has been, enerally speaking, confined to the manut acture of articles which can be made integrally of a singlepieceof metal or of a :plurality of pieces riveted together. Owing to its lightness, durability and non-corrosive properties the field of usefulness of aluminum would be greatly broadened by the introduction of an efficient solder. r

My solder enables a (plurality of pieces of' aluminum to be unite together or a piece of aluminum to be united to another metal with so strong a bond that the soldered union is stronger and more durablethan the aluminum itself.

My solder.is composed of tin; antimony;

lead; zinc, and copper, which elements I prefer to use in substantially :-the following. proportions, viz.'tin, 49.05 per cent.; antimony, 3.43 per cent. lead, 26.06 per cent. zinc, 20.31 or cent., and copper, 1.10 or cent. The e ements are thoroughly ming ed together in a melted state and allowed to harden in the form of sticks or bars of a convenient size and shape for handling.

l/Vhen metal surfaces are to be united with my solder, I first rub the'surfaces with rosin and then apply m solder with a soldering iron, and the resu t is a union between the metal pieces which is morev strong and durable than the metal itself.

. What I desire to claim is "L A compound for solderin composed 0 copper.

2. The herein described solder for aluminum consisting of a composition of substanaluminum tm, antlmony, lea zinc, and

tially the following proportions, tin, 49.05%

antimony, 3.43%.; lead, 26.06%; zinc, 20.31%, and copper, 1.10%, for the purposes described.

Signed at Pittsburg, Pa., this 24th day of July, 1909.

LOUIS GOPPMAN.

Witnesses:

E.-A. Lawnnnon, T. CHALMnns DUFF. 

